Thermal Engineer (With Packaging/Thermal Measurement Experience) Job

Job description:
Qualcomm is searching for Thermal Engineers.
Duties and tasks:
As a Qualcomm {Hardware} Engineer, you’ll plan, design, optimize, confirm, and take a look at digital programs, bring-up yield, circuits, mechanical programs, Digital/Analog/RF/optical programs, tools and packaging, take a look at programs, FPGA, and/or DSP programs that launch cutting-edge, world class merchandise. Qualcomm {Hardware} Engineers collaborate with cross-functional groups to develop options and meet efficiency necessities.
{Qualifications} required:
Bachelor’s diploma in Laptop Science, Electrical/Electronics Engineering, Engineering, or associated discipline.
Job operate:
- Thermal evaluation of Superior packaging (2.5/3DIC, chiplets) to contribute in leading edge pkg resolution in datacenter and compute area
- Thermal evaluation methodology growth: encompassing SoC, package deal and programs, for numerous Qualcomm merchandise going into smartphones, laptops, automotives and digital actuality headsets.
Expertise:
- Knowledge of Superior packaging (2.5/3DIC, chiplets) OR palms on expertise in Thermal Measurement
- Ought to possess robust analytical expertise and mathematical modeling skills.
- Good information of scripting in PERL/Python required
- Some publicity to Machine Studying algorithms/frameworks will probably be a plus.
- Have to have thorough information of warmth switch mechanisms and CFD.
- Proficiency with state-of-the-art thermal evaluation instruments – Ansys Icepak/Flotherm
Expertise: BE/ME graduates with 1 to three years of expertise
Job/Req. ID: 3069288
Firm: Qualcomm
Location: Bangalore, KA
Job Class: Laptop Science or Electronics or Electrical Engineering
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